 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| MC10EP56, MC100EP56 3.3V / 5V ECL Dual Differential 2:1 Multiplexer Description The MC10/100EP56 is a dual, fully differential 2:1 multiplexer. The differential data path makes the device ideal for multiplexing low skew clock or other skew sensitive signals. Multiple VBB pins are provided. The VBB pin, an internally generated voltage supply, is available to this device only. For single-ended input conditions, the unused differential input is connected to VBB as a switching reference voltage. VBB may also rebias AC coupled inputs. When used, decouple VBB and VCC via a 0.01 mF capacitor and limit current sourcing or sinking to 0.5 mA. When not used, VBB should be left open. The device features both individual and common select inputs to address both data path and random logic applications. The 100 Series contains temperature compensation. Features http://onsemi.com MARKING DIAGRAMS* 20 MC100EP56 AWLYYWWG SOIC-20 DW SUFFIX CASE 751D 1 * 360 ps Typical Propagation Delays * Maximum Frequency > 3 GHz Typical * PECL Mode Operating Range: VCC = 3.0 V to 5.5 V * NECL Mode Operating Range: VCC = 0 V * * * * * * with VEE = 0 V with VEE = -3.0 V to -5.5 V Open Input Default State Safety Clamp on Inputs Separate and Common Select Q Output Will Default LOW with Inputs Open or at VEE VBB Outputs Pb-Free Packages are Available TSSOP-20 DT SUFFIX CASE 948R XXXX EP56 ALYWG G 20 1 XXXX EP56 ALYWG G QFN-20 MN SUFFIX CASE 485E xxxx D A L, WL Y, YY W, WW G, G = MC10 or 100 = Date Code = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. (c) Semiconductor Components Industries, LLC, 2006 December, 2006 - Rev. 14 1 Publication Order Number: MC10EP56/D MC10EP56, MC100EP56 COM_SEL Table 1. PIN DESCRIPTION PIN SEL1 15 VCC 14 Q1 13 Q1 12 VEE 11 D0a* - D1a* D0a* - D1a* D0b* - D1b* D0b* - D1b* SEL0* - SEL1* COM_SEL* VBB0, VBB1 Q0 - Q1 Q0 - Q1 VCC VEE FUNCTION ECL Input Data a ECL Input Data a Invert ECL Input Data b ECL Input Data b Invert ECL Indiv. Select Input ECL Common Select Input Output Reference Voltage ECL True Outputs ECL Inverted Outputs Positive Supply Negative Supply Exposed Pad VCC 20 Q0 19 Q0 18 SEL0 17 16 1 0 1 0 1 D0a 2 D0a 3 4 VBBO D0b 5 D0b 6 7 D1a D1a 8 VBB1 9 D1b 10 D1b EP * Pins will default LOW when left open. Warning: All VCC and VEE pins must be externally connected to Power Supply to guarantee proper operation. Table 2. TRUTH TABLE SEL0 X L L H H SEL1 X L H H L COM_SEL H L L L L Q0, Q0 a b b a a Q1, Q1 a b a a b Figure 1. 20-Lead Package (Top View) and Logic Diagram Exposed Pad D0a 20 D0a VCC 19 18 Q0 17 Q0 16 VBB0 D0b D0b D1a D1a 1 2 3 4 5 MC10/100EP56 15 14 13 12 11 SEL0 COM_SEL SEL1 VCC Q1 6 NOTE: 7 8 9 10 VBB1 D1b D1b VEE Q1 The Exposed Pad (EP) on package bottom must be attached to a heat-sinking conduit. The Exposed Pad may only be electrically connected to VEE. Figure 1. QFN-20 Pinout (Top View) http://onsemi.com 2 MC10EP56, MC100EP56 Table 3. ATTRIBUTES Characteristics Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Human Body Model Machine Model Charged Device Model Pb Pkg Level 1 Level 1 N/A Value 75 kW N/A > 2 kV > 150 V > 2 kV Pb-Free Pk Level 3 Level 3 Level 1 Value Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) SOIC TSSOP QFN Flammability Rating Transistor Count Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Oxygen Index: 28 to 34 UL 94 V-0 @ 0.125 in 140 Devices Table 4. MAXIMUM RATINGS Symbol VCC VEE VI Iout IBB TA Tstg qJA qJC qJA qJC qJA qJC Tsol Parameter PECL Mode Power Supply NECL Mode Power Supply PECL Mode Input Voltage NECL Mode Input Voltage Output Current VBB Sink/Source Operating Temperature Range Storage Temperature Range Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Wave Solder Pb Pb-Free 0 lfpm 500 lfpm Standard Board 0 lfpm 500 lfpm Standard Board 0 lfpm 500 lfpm Standard Board <2 to 3 sec @ 248C <2 to 3 sec @ 260C 20 TSSOP 20 TSSOP 20 TSSOP 20 SOIC 20 SOIC 20 SOIC QFN-20 QFN-20 QFN-20 Condition 1 VEE = 0 V VCC = 0 V VEE = 0 V VCC = 0 V Continuous Surge VI VCC VI VEE Condition 2 Rating 6 -6 6 -6 50 100 0.5 -40 to +85 -65 to +150 140 100 23 to 41 90 60 33 to 35 47 33 18 265 265 Unit V V V V mA mA mA C C C/W C/W C/W C/W C/W C/W C/W C/W C/W C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 3 MC10EP56, MC100EP56 Table 5. 10EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 2) -40C Symbol IEE VOH VOL VIH VIL VBB VIHCMR Characteristic Power Supply Current Output HIGH Voltage (Note 3) Output LOW Voltage (Note 3) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Output Voltage Reference Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 4) Input HIGH Current Input LOW Current -150 Min 50 2165 1365 2090 1365 1790 2.0 1890 Typ 61 2290 1490 Max 75 2415 1615 2415 1690 1990 3.3 Min 50 2230 1430 2155 1460 1855 2.0 1955 25C Typ 63 2355 1555 Max 75 2480 1680 2480 1755 2055 3.3 Min 55 2290 1490 2215 1490 1915 2.0 2015 85C Typ 65 2415 1615 Max 78 2540 1740 2540 1815 2115 3.3 Unit mA mV mV mV mV mV V IIH IIL 150 -150 150 -150 150 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to -2.2 V. 3. All loading with 50 W to VCC - 2.0 V. 4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 6. 10EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 5) -40C Symbol IEE VOH VOL VIH VIL VBB VIHCMR Characteristic Power Supply Current Output HIGH Voltage (Note 6) Output LOW Voltage (Note 6) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Output Voltage Reference Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 7) Input HIGH Current Input LOW Current -150 Min 50 3865 3065 3790 3065 3490 2.0 3590 Typ 61 3990 3190 Max 75 4115 3315 4115 3390 3690 5.0 Min 50 3930 3130 3855 3130 3555 2.0 3655 25C Typ 63 4055 3255 Max 75 4180 3380 4180 3455 3755 5.0 Min 55 3990 3190 3915 3190 3615 2.0 3715 85C Typ 65 4115 3315 Max 78 4240 3440 4240 3515 3815 5.0 Unit mA mV mV mV mV mV V IIH IIL 150 -150 150 -150 150 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to -0.5 V. 6. All loading with 50 W to VCC - 2.0 V. 7. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. http://onsemi.com 4 MC10EP56, MC100EP56 Table 7. 10EP DC CHARACTERISTICS, NECL VCC = 0 V, VEE = -5.5 V to -3.0 V (Note 8) -40C Symbol IEE VOH VOL VIH VIL VBB VIHCMR Characteristic Power Supply Current Output HIGH Voltage (Note 9) Output LOW Voltage (Note 9) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Output Voltage Reference Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 10) Input HIGH Current Input LOW Current -150 Min 50 -1135 -1935 -1210 -1935 -1510 -1410 Typ 61 -1010 -1810 Max 75 -885 -1685 -885 -1610 -1310 0.0 Min 50 -1070 -1870 -1145 -1870 -1445 -1345 25C Typ 63 -945 -1745 Max 75 -820 -1620 -820 -1545 -1245 0.0 Min 55 -1010 -1810 -1085 -1810 -1385 -1285 85C Typ 65 -885 -1685 Max 78 -760 -1560 -760 -1485 -1185 0.0 Unit mA mV mV mV mV mV V VEE+2.0 VEE+2.0 VEE+2.0 IIH IIL 150 -150 150 -150 150 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 8. Input and output parameters vary 1:1 with VCC. 9. All loading with 50 W to VCC - 2.0 V. 10. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. 100EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 11) -40C Symbol IEE VOH VOL VIH VIL VBB VIHCMR Characteristic Power Supply Current Output HIGH Voltage (Note 12) Output LOW Voltage (Note 12) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Output Voltage Reference Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 13) Input HIGH Current Input LOW Current -150 Min 50 2155 1355 2075 1355 1775 2.0 1875 Typ 61 2280 1480 Max 75 2405 1605 2420 1675 1975 3.3 Min 50 2155 1355 2075 1355 1775 2.0 1875 25C Typ 63 2280 1480 Max 77 2405 1605 2420 1675 1975 3.3 Min 55 2155 1355 2075 1355 1775 2.0 1875 85C Typ 66 2280 1480 Max 80 2405 1605 2420 1675 1975 3.3 Unit mA mV mV mV mV mV V IIH IIL 150 -150 150 -150 150 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 11. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to -2.2 V. 12. All loading with 50 W to VCC - 2.0 V. 13. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. http://onsemi.com 5 MC10EP56, MC100EP56 100EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 14) -40C Symbol IEE VOH VOL VIH VIL VBB VIHCMR Characteristic Power Supply Current Output HIGH Voltage (Note 15) Output LOW Voltage (Note 15) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Output Voltage Reference Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 16) Input HIGH Current Input LOW Current -150 Min 50 3855 3055 3775 3055 3475 2.0 3575 Typ 61 3980 3180 Max 75 4105 3305 4120 3375 3675 5.0 Min 50 3855 3055 3775 3055 3475 2.0 3575 25C Typ 63 3980 3180 Max 77 4105 3305 4120 3375 3675 5.0 Min 55 3855 3055 3775 3055 3475 2.0 3575 85C Typ 66 3980 3180 Max 80 4105 3305 4120 3375 3675 5.0 Unit mA mV mV mV mV mV V IIH IIL 150 -150 150 -150 150 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 14. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to -0.5 V. 15. All loading with 50 W to VCC - 2.0 V. 16. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 8. 100EP DC CHARACTERISTICS, NECL VCC = 0 V, VEE = -5.5 V to -3.0 V (Note 17) -40C Symbol IEE VOH VOL VIH VIL VBB VIHCMR Characteristic Power Supply Current Output HIGH Voltage (Note 18) Output LOW Voltage (Note 18) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Output Voltage Reference Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 19) Input HIGH Current Input LOW Current -150 Min 50 -1145 -1945 -1225 -1945 -1525 -1425 Typ 61 -1020 -1820 Max 75 -895 -1695 -880 -1625 -1325 0.0 Min 50 -1145 -1945 -1225 -1945 -1525 -1425 25C Typ 63 -1020 -1820 Max 77 -895 -1695 -880 -1625 -1325 0.0 Min 55 -1145 -1945 -1225 -1945 -1525 -1425 85C Typ 66 -1020 -1820 Max 80 -895 -1695 -880 -1625 -1325 0.0 Unit mA mV mV mV mV mV V VEE+2.0 VEE+2.0 VEE+2.0 IIH IIL 150 -150 150 -150 150 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 17. Input and output parameters vary 1:1 with VCC. 18. All loading with 50 W to VCC - 2.0 V. 19. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. http://onsemi.com 6 MC10EP56, MC100EP56 Table 9. AC CHARACTERISTICS VCC = 0 V; VEE = -3.0 V to -5.5 V or VCC = 3.0 V to 5.5 V; VEE = 0 V (Note 20) -40C Symbol fmax tPLH, tPHL Characteristic Maximum Frequency (See Figure 2 Fmax/JITTER) Propagation Delay to Output Differential Min Typ >3 Max Min 25C Typ >3 Max Min 85C Typ >3 Max Unit GHz ps 250 250 250 340 340 350 50 0.2 150 Q, Q 70 800 120 450 450 450 100 200 <1 1200 170 150 80 270 270 270 360 340 360 50 0.2 800 130 470 470 470 100 200 <1 1200 180 150 100 300 300 300 400 400 400 50 0.2 800 150 500 500 500 100 200 <1 1200 230 ps ps mV ps D to Q, Q SEL to Q, Q COM_SEL to Q, Q tSKEW tJITTER VPP tr tf Within-Device Skew (Note 21) Device to Device Skew Random Clock Jitter (See Figure 2 Fmax/JITTER) Input Voltage Swing (Differential Configuration) Output Rise/Fall Times (20% - 80%) NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 20. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC - 2.0 V. 21. Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays are measured from the cross point of the inputs to the cross point of the outputs. 1000 VOUTamplitude (mVpp) 5V 3.3 V 600 10 8 7 6 5 4 400 3 2 1 0 JITTER OUT ps (RMS) 9 800 200 1.0 Driver Device Q Zo = 50 W 50 W 50 W D Figure 3. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D - Termination of ECL Logic Devices.) http://onsemi.com 7 EEEEEEEEEEEEEE EE EE EE (JITTER) 1.5 2.0 2.5 FREQUENCY (GHz) 3.0 Figure 2. Fmax/Jitter @ 255C Q Zo = 50 W D Receiver Device VTT VTT = VCC - 2.0 V MC10EP56, MC100EP56 ORDERING INFORMATION Device MC10EP56DT MC10EP56DTG MC10EP56DTR2 MC10EP56DTR2G MC10EP56MNG MC10EP56MNTXG MC100EP56DW MC100EP56DWG MC100EP56DWR2 MC100EP56DR2G MC100EP56DT MC100EP56DTG MC100EP56DTR2 MC100EP56DTR2G MC100EP56MNG MC100EP56MNTXG Package TSSOP-20 TSSOP-20 (Pb-Free) TSSOP-20 TSSOP-20 (Pb-Free) QFN-20 (Pb-Free) QFN-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) TSSOP-20 TSSOP-20 (Pb-Free) TSSOP-20 TSSOP-20 (Pb-Free) QFN-20 (Pb-Free) QFN-20 (Pb-Free) Shipping 75 Units / Rail 75 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 92 Units / Rail 3000 / Tape & Reel 38 Units / Rail 38 Units / Rail 1000 / Tape & Reel 1000 / Tape & Reel 75 Units / Rail 75 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 92 Units / Rail 3000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D AN1406/D AN1503/D AN1504/D AN1568/D AN1672/D AND8001/D AND8002/D AND8020/D AND8066/D AND8090/D - ECL Clock Distribution Techniques - Designing with PECL (ECL at +5.0 V) - ECLinPSt I/O SPiCE Modeling Kit - Metastability and the ECLinPS Family - Interfacing Between LVDS and ECL - The ECL Translator Guide - Odd Number Counters Design - Marking and Date Codes - Termination of ECL Logic Devices - Interfacing with ECLinPS - AC Characteristics of ECL Devices http://onsemi.com 8 MC10EP56, MC100EP56 PACKAGE DIMENSIONS SO-20 WB CASE 751D-05 ISSUE G D A 11 X 45 _ q NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ H M B M 20 10X 0.25 E 1 10 20X B 0.25 M B TA S B S A e SEATING PLANE h 18X A1 T C http://onsemi.com 9 L MC10EP56, MC100EP56 PACKAGE DIMENSIONS TSSOP-20 CASE 948E-02 ISSUE C 20X K REF M 2X L/2 20 11 J J1 B -U- N L PIN 1 IDENT 1 10 0.15 (0.006) T U S A -V- N F DETAIL E -W- DIM A B C D F G H J J1 K K1 L M C D 0.100 (0.004) -T- SEATING PLANE G H DETAIL E SOLDERING FOOTPRINT* 7.06 1 0.36 16X 16X 1.26 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 IIII IIII IIII SECTION N-N 0.25 (0.010) M 0.15 (0.006) T U S 0.10 (0.004) TU S V S K K1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ 0.65 PITCH DIMENSIONS: MILLIMETERS MC10EP56, MC100EP56 PACKAGE DIMENSIONS QFN-20 CASE 485E-01 ISSUE O -X- A M N B 0.25 (0.010) T 0.25 (0.010) T R 0.08 (0.003) T E H L 6 5 10 11 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION D APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A B C D E F G H J K L M N P R MILLIMETERS MIN MAX 4.00 BSC 4.00 BSC 0.80 1.00 0.23 0.35 2.75 2.85 2.75 2.85 0.50 BSC 1.38 1.43 0.20 REF 0.00 0.05 0.35 0.45 2.00 BSC 2.00 BSC 1.38 1.43 0.60 0.80 INCHES MIN MAX 0.157 BSC 0.157 BSC 0.031 0.039 0.009 0.014 0.108 0.112 0.108 0.112 0.020 BSC 0.054 0.056 0.008 REF 0.000 0.002 0.014 0.018 0.079 BSC 0.079 BSC 0.054 0.056 0.024 0.031 -Y- J C K -T- SEATING PLANE G F 1 20 16 15 D NOTE 3 M P 0.10 (0.004) TXY ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 11 MC10EP56/D |
Price & Availability of MC10EP5606
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |